The present invention relates to a method for producing an electronic component (1), comprising the steps executed in the following sequence: providing at least one carrier element (5, 6,), having a micro component receptacle (17) configured to establish contact with at least one micro component (7); overmolding the carrier element (5, 6) with a housing (2), wherein the micro component receptacle (17) is arranged in a cavity (3) of the housing (2), the cavity being open on at least one side; inserting the at least one micro component (7) into the micro component receptacle (17) in the cavity (3), in order for the at least one micro component (7) to establish contact with the carrier element (5, 6); and injecting the cavity (3) with a filler material (4) in order to fixedly position the at least one contacted micro component (7) in the housing (2) and in the micro component receptacle (17).
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