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wet etching

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Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers or flat panel display substrates
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These structures are used in certain chemical sensors, but are difficult to produce by wet etching.
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Wet etching is used primarily in the manufacture of micromechanical devices.
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Researchers also worked on dry and wet etching techniques, electron-beam lithography, and device bonding.
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P6-131 Determine the rate law and rate law parameters for the wet etching of an aluminum silicate.
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Usually, silicon wafers are used as substrates for bulk micromachining, as they can be anisotropically wet etched, forming highly regular structures.
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The process can easily be used to etch completely through a silicon substrate, and etch rates are 3–6 times higher than wet etching.
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Like surface micromachining, bulk micromachining can be performed with wet or dry etches, although the most common etch in silicon is the anisotropic wet etch.
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Although wet etching processes are rapid and inexpensive, they are difficult to use in specialised situations including fabrication of micronozzles for ink-jet print heads.
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These include molding and plating, wet etching (KOH, TMAH) and dry etching (RIE and DRIE), electro discharge machining (EDM), and other technologies capable of manufacturing small devices.
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Wet etching typically uses alkaline liquid solvents, such as potassium hydroxide (KOH) or tetramethylammonium hydroxide (TMAH) to dissolve silicon which has been left exposed by the photolithography masking step.
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Wet chemical etching is the older of the two processes and is easier to use.
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Wet chemical etching usually yields A values around 1.0, indicating isotropic etching.
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Machines and installations for the wet chemical etching of substrates, in particular semiconductor substrates
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Wet chemical etching consists in selective removal of material by dipping a substrate into a solution that dissolves it.
eje de basculamientoWikiMatrix WikiMatrix
In combination with wet anisotropic etching as described above, ECE has been used successfully for controlling silicon diaphragm thickness in commercial piezoresistive silicon pressure sensors.
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Photolithography is typically used with metal or other thin film deposition, wet and dry etching.
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This step is followed by conventional wet or dry etching to form a large cavity.
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This process is based on alternative techniques (all-dry silicon-etch based process) that in comparison to the most commonly used ones (wet silicon etching) demonstrates several attractive features in terms of related design limitations, complexity, uniformity and manufacturability.
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After defining the silicon mesa by lithography and dry etching, wet oxidation was performed to separate it into two wires with silicon oxide in between.
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Her forehead was wet with sweat, and pain etched fine lines into her beautiful face.
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Intaglio can be performed using direct, dry techniques in which the artist works without the use of acids, or indirect, wet techniques such as etching and aquatint.
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They also act as surface tension reducers and wetting agents, in particular in plastics etching.
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They also act as surface tension reducers and wetting agents, in particular in plastics etching
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