The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal-graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.
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