Metadata
Author: patents-wipo
Data
English[en]
The present invention relates to a high melting point lead-free alloy solder that does not contain lead (Pb), which is harmful to the human body, and that can be soldered onto high melting point electronic components, and more specifically relates to a high melting point lead-free solder composition and a high melting point lead-free solder alloy comprising bismuth (Bi), silver (Ag), copper (Cu) and antimony (Sb), and an application thereof.
French[fr]
La présente invention concerne une brasure en alliage à haut point de fusion sans plomb qui ne contient pas de plomb (Pb), celui-ci étant nocif pour le corps humain, et qui peut être brasée sur des composants électroniques à haut point de fusion, et concerne plus particulièrement une composition de brasure à haut point de fusion sans plomb et un alliage de brasure à haut point de fusion sans plomb comportant du bismuth (Bi), de l'argent (Ag), du cuivre (Cu) et de l'antimoine (Sb), et une application de celle-ci.
Korean[ko]
본 발명은 인체에 유해한 납(Pb)을 포함하지 않고, 고융점 전자부품에 솔더링 가능한 고융점 무연 합금 솔더에 관한 것으로, 보다 구체적으로는 비스무트(Bi), 은(Ag), 구리(Cu) 및 안티몬(Sb)을 포함하는 것을 특징으로 하는, 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 및 이의 용도에 관한 것이다.