Metadata
Author: patents-wipo
Data
English[en]
The etching-solution composition comprises between 5 and 20 wt.% of hydrogen peroxide, between 0.1 and 5 wt.% of a sulphonic acid compound, between 0.1 and 2 wt.% of a carbonyl based organic acid compound, between 0.1 and 0.4 wt.% of a fluorine compound, between 0.01 and 3 wt.% of an azole based compound, and a remainder of water.
French[fr]
La composition de solution de gravure comprend entre 5 et 20 % en poids de peroxyde d'hydrogène, entre 0,1 et 5 % en poids d'un composé d'acide sulfonique, entre 0,1 et 2 % en poids d'un composé d'acide organique à base de carbonyle, entre 0,1 et 0,4 % en poids d'un composé du fluor, entre 0,01 et 3 % en poids d'un composé à base d'azole, le reste étant de l'eau.
Korean[ko]
상기 식각액 조성물은, 5 내지 20 중량%의 과산화수소, 0.1 내지 5 중량%의 술폰산 화합물, 0.1 내지 2 중량%의 카보닐계 유기산 화합물, 0.1 내지 0.4 중량%의 불소 화합물, 0.01 내지 3 중량%의 아졸계 화합물, 및 나머지 물을 포함한다.