Besonderhede van voorbeeld: -8272565789003590625

Metadata

Author: patents-wipo

Data

English^[en]

Epoxy resin composition for sealing and electronic part device

French^[fr]

Composition de resine epoxyde pour sceller un dispositif electronique

Japanese^[ja]

封止用エポキシ樹脂成形材料及び電子部品装置

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