Metadata
Author: patents-wipo
Data
English[en]
The present invention relates to a semiconductor device and, more specifically, to a semiconductor device having improved heat-dissipation characteristics, which is capable effectively discharging heat, which is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.
French[fr]
La présente invention concerne un dispositif semiconducteur et, plus spécifiquement, un dispositif semiconducteur comportant des caractéristiques améliorées de dissipation de chaleur, qui est capable d'évacuer efficacement la chaleur générée à l'intérieur du dispositif semiconducteur d'une structure tridimensionnelle stratifiée, à l'extérieur du dispositif semiconducteur, au moyen d'un connecteur interne utilisé pendant le soudage par diffusion.
Korean[ko]
본 발명은 반도체 장치에 관한 것으로, 더욱 상세하게는 3차원 적층 구조의 반도체 장치 내부에서 발생한 열을 본딩 시 이용되는 내부커넥터를 이용하여 효과적으로 반도체 장치의 외부로 방출시킬 수 있는 방열 특성이 개선된 반도체 장치에 관한 것이다.