Metadata
Author: patents-wipo
Data
English[en]
The present invention relates to a plate for a shield can which has superior heat resistance and insulation and is used as a mother material for the shield can for blocking electromagnetic waves of electronic components, a manufacturing method thereof, and a shield can mounted on a printed circuit board (PCB) to cover the electronic components disposed on the PCB through working the sheet metal of the plate.
French[fr]
L'invention concerne également le procédé de fabrication de ladite plaque et un boîtier de blindage monté sur une carte de circuits imprimés (PCB) pour couvrir les composants électroniques disposés sur la PCB par le biais du travail de la feuille métallique de la plaque.
Korean[ko]
전자부품의 전자파 차폐를 위한 실드캔의 모재(母材)로서 내열성과 절연성이 뛰어난 실드캔용 판재 및 이의 제조방법과 상기 판재의 판금가공에 의해 PCB 상의 전자부품을 덮도록 상기 PCB에 탑재되는 실드캔에 관한 것이다.