Metadata
Author: patents-wipo
Data
English[en]
The method involves and sequentially coating, ablating, and curing alternate dielectric and conductive ink layers on a substrate incorporating cured tracks of ink produced by the method noted above.
French[fr]
Ce procédé consiste à enduire, ablater et cuire successivement des couches de pâte diélectriques et conductrices alternées sur un substrat comportant des pistes de pâtes cuites obtenues par ledit procédé.