Metadata
Author: patents-wipo
Data
English[en]
The present invention relates to a plate processing device for processing one surface of a plate having a band shape, and the plate processing device comprises: a plurality of cutting members for cutting one surface of a plate by rotating the plate; a base unit on which each of the plurality of cutting members are rotationally provided; a first driving unit which rotates the base unit and moves at least one cutting member from among the plurality of cutting members to a cutting position; a second driving unit for rotating the cutting member located at the cutting position; and a third driving unit which moves the base unit in a processing direction of the plate so as to move the cutting member located at the cutting position in the processing direction of the plate.
French[fr]
La présente invention concerne un dispositif de traitement de plaque permettant de traiter une surface d'une plaque en forme de bande, ledit dispositif comprenant : une pluralité d'éléments de coupe, qui coupent une surface d'une plaque en faisant tourner la plaque ; une unité de base, sur laquelle chacun de la pluralité des éléments de coupe sont prévus rotatifs ; une première unité d'entraînement, qui fait tourner l'unité de base et déplace au moins un élément de coupe de la pluralité des éléments de coupe, dans une position de coupe ; une deuxième unité d'entraînement, qui fait tourner l'élément de coupe se situant en position de coupe ; et une troisième unité d'entraînement, qui déplace l'unité de base dans une direction de traitement de la plaque, de manière à déplacer l'élément de coupe se situant en position de coupe dans la direction de traitement de la plaque.
Korean[ko]
본 발명은 띠 형상을 가지는 판재의 일면을 가공하는 판재 가공 장치에 관한 것으로서, 판재의 일면을 회전에 의해 절삭하는 복수 개의 절삭 부재, 복수 개의 절삭 부재가 각각 회전 가능하게 설치되는 베이스부, 베이스부를 회전시켜 복수 개의 절삭 부재 중 적어도 어느 하나를 절삭 위치로 이동시키는 제1 구동부, 절삭 위치에 위치한 절삭 부재를 회전시키는 제2 구동부, 및 베이스부를 판재의 가공 방향으로 이동시켜 절삭 위치에 위치한 절삭 부재를 판재의 가공 방향으로 이동시키는 제3 구동부를 포함한다.