封装 oor Engels

封装

Vertalings in die woordeboek Sjinees - Engels

encapsulation

naamwoord

act of enclosing in a capsule

本发明公开了一种用于通用路由封装隧道的数据包转发方法及装置。
Disclosed are a data package forwarding method and device for a generic route encapsulation tunnel.

encapsulate

werkwoord

object-oriented programming: To enclose objects in a common interface

本发明公开了一种用于通用路由封装隧道的数据包转发方法及装置。
Disclosed are a data package forwarding method and device for a generic route encapsulation tunnel.

packaging

naamwoord

这反过来能进一步增加封装密度——从而提高效率。
This, in turn, would allow for further increases in packaging density – and thus efficiency.

to encapsulate · seal · to enclose · to seal inside · to wrap

voorbeelde

热界面材料层及包括热界面材料层的层叠封装件器件
Thermal interface material layer and package-on-package device comprising thermal interface material layer

联合王国已开展研究,探讨标记和封装手段在核查设备认证及弹头运输、储存和拆除过程中的监管链的维持等方面可能发挥的作用。
The United Kingdom has conducted studies looking at potential roles for tags and seals for inspection equipment authentication as well as chain-of-custody maintenance during transport, storage and dismantlement of the warhead

所述方法为采用一种光波长转换部件对LED芯片进行封装,所述光波长转换部件至少具有两种光激发性能的光转换滤光器;所述两种光转换滤光器为在LED芯片发射光的波长从低到高激发下,经过其转换后发出光的发光强度呈现相反的变化趋势。 该方法可以减小LED光源发出光的色度分布的离散程度、提高成品LED光源良率。
The method can reduce the discrete degree of chroma distribution of light transmitted by the LED light source, and improve the defect-free rate of the LED light source.

本发明采用注塑带有封转芯片槽位的卡基封装芯片,无废料产生,大大节约了卡基材料,无需废料处理设备的投资,降低了整个封装工序的成本。
The dimensions of the card base are 25 mm×15 mm.

本发明涉及空气过滤器产品技术领域,特指一种高效率捕集空气中颗粒物的一体化静电集尘装置及其驻极处理工艺。 该集尘装置的主体由多层集尘板叠加构成,其中集尘板一体成型有供气体通过的阵列孔洞,集尘板是微发泡的,可添加驻极增强材料、负离子发射材料和磁性材料的塑料材料,于每层集尘板的上下表面设置有施加高压电场的密闭导电膜,其中的一层或数层集尘板中可安装有离子发射装置,在叠加结构的侧面,封装有向高低电位电极供电的高压电源,叠加结构和高压电源被整体封装于保护结构外框中,外部使用低压直流或市电供电。
The present invention relates to the technical field of air filter products, and more particularly to an integrated electrostatic dust collection device for efficiently capturing particles in air and an electret processing technique thereof.

一种玻璃封装结构和封装方法,所述结构包括一有源玻璃基板(200)和一封装玻璃基板(100),于所述有源玻璃基板(200)上形成一有源区域(201),在所述封装玻璃基板(100)之一表面形成突出于所述表面的玻璃封装条(101),将所述封装玻璃基板(100)叠置于所述有源玻璃基板(200)上,通过激光照射所述玻璃封装条(101)使所述有源玻璃基板(200)与所述封装玻璃基板(100)接合在一起。
The structure comprises an active glass substrate (200) and an encapsulation glass substrate (100), wherein an active area (201) is formed on the active glass substrate (200), on one surface of the encapsulation glass substrate (100) a glass encapsulation stripe (101) protruding from the surface is formed, the encapsulation glass substrate (100) is superimposed on the active glass substrate (200), and the active glass substrate (200) is engaged with the encapsulation glass substrate (100) by irradiating the glass encapsulation stripe (101) by laser.

一种QFN封装焊点形态预测方法及装置
Method and device for predicting shape of qfn package solder joint

一种太阳能模块(100,100'),包括背板(110,110')、透光前板(120,120')、设置于背板与透光前板之间的太阳能电池(130),以及用以固定位于其间的太阳能电池的封装材(140)。
The reflectivity of the light receiving surface is greater than 90%, and the reflectivity of the back surface is not greater than 10%.

一种集成封装电源
Integrated packaging power source

本发明公开了一种主备用设备间的信息同步方法和服务器。 其中,该方法包括:主用设备和备用设备建立同步通道,同步通道包括设备级通道、子卡级通道和子卡上的备份组级通道;主用设备确定有用户信息需要同步,根据用户所在的备份组确定对应的子卡级通道或备份组级通道,按照子卡级通道或备份组级通道对应的地址和端口封装同步信息,通过子卡级通道或备份组级通道将封装后的同步信息发送给备用设备;备用设备解析同步信息得到地址和端口,将同步信息转发至端口对应的子卡,子卡对同步信息进行处理。
With the present invention, the problem of high load of a main control unit is solved, the mode is not limited by the performance bottleneck of the main control unit, and reliable guarantee is provided for the switching between the master equipment and the standby equipment.

一种封装结构,包括:线路载板(100),线路载板(100)包括第一表面(11)和与第一表面(11)相对的第二表面(12),线路载板(100)上具有若干呈矩阵排布的承载单元,承载单元的第一表面(11)具有若干输入焊盘(101),承载单元的第二表面(12)具有若干输出焊盘(102),输入焊盘(101)和输出焊盘(102)通过互连结构(103)相连;预封面板,预封面板包括第一塑封层(205),第一塑封层(205)内具有若干呈矩阵排布的集成单元,每个集成单元内具有至少一个半导体芯片(200),半导体芯片(200)表面上具有若干焊盘(201),焊盘上(201)具有第一金属凸块(203);预封面板倒装在线路载板(100)的第一表面(11)上,第一金属凸块(203)与输入焊盘(101)焊接在一起;填充承载单元的第一表面(11)和预封面板之间空间的填充层(209);位于承载单元的第二表面(12)的输出焊盘(102)上的第二金属凸块(210),该封装结构集成度提高。
The pre-packaged panel is inversely mounted on the first surface (11) of the line carrier plate (100), and the first metal protrusions (203) and the input bonding pads (101) are soldered together.

中所列的金属或合金都受到限制,不论是否用铝、镁、锆或铍封装。
The metals or alloys listed in 1.

其中,信息发送设备包括用于获取信息发送设备的当前界面信息的信息提取模块、用于将当前界面信息打包并封装成标准格式的数据包的信息编码模块以及用于利用无线传输技术将数据包传输到信息接收设备的信息传输模块。
The communications system comprises an information sending device and an information receiving device.

本发明提供了一种PDN连接处理方法及装置,该方法包括:建立多个分组数据网PDN连接;在数据报文中封装能够唯一识别单一PDN连接的标识。
Provided are a PDN connection processing method and device.

该光开关,能够有效减小光开关的体积,易于集成、对准和封装。
The optical switch can reduce the volume of optical switches effectively and is also easy for integration, alignment and encapsulation.

一种地震临震监测用探头,包括:用于与待测点直接耦合的传声头(10);用于将地声信号转换为电信号的多组传感器(30);用于对电信号依次进行信号滤波、放大以及模数转换的预处理电路模块(50);用于传输预处理电路模块(50)的输出信号、并为预处理电路模块(50)提供电源的供电及信号电缆(60);供电及信号电缆(60)的供电输出端和信号输入端、多组传感器(30)和预处理电路模块(50)通过封装结构(40)封装并固定于传声头(10)的输出端。
Since a frequency response range of sensor groups covers sound wave frequency bands of different earthquake sounds, a probe is able to capture the intensity, frequentness and frequency of different earthquake sound information, thereby being applicable to monitor the earthquake inoculation process and imminent earthquake prediction work; meanwhile, one sensor in each group of the sensor groups can be used as a backup of the other sensor, so that the reliability of the probe can be improved.

立即对这些地方的材料和空气质量进行检验,如果证实含石棉材料是含石棉受扰动,就应立即封装或消除被扰动的材料。
Immediate material and air-quality testing of such areas is undertaken, and if the ACM are confirmed to be disturbed, immediate encapsulation or abatement of the disturbed materials is performed

控制器模块(2)、进气压力传感器模块(4)和电源模块(5)均安装在电路板(3)上;控制器模块(2)、电路板(3)、进气压力传感器模块(4)和电源模块(5)由封装壳体(1)封装;进气压力传感器模块(4)与控制器模块(5)连接。
The controller module (2), the intake pressure sensor module (4) and the power supply module (5) are all installed on the circuit board (3); the controller module (2), the circuit board (3), the intake pressure sensor module (4) and the power supply module (5) are packaged by the package shell body (1); the intake pressure sensor module (4) is connected to the controller module (5).

满意地注意到正如秘书长的报告1 第8段所述,由于通过国内、区域和国际上具有法律约束力的文书有效执行《关于危险货物运输的建议书:规章范本》,国际运输的危险货物必须以标有“UN”标记的容器、集装箱和罐体封装,以证明它们符合在批准所加标记国相关当局控制下成功测试的某种设计类型,
Noting with satisfaction that, owing to the effective implementation of the Recommendations on the Transport of Dangerous Goods: Model Regulations through national, regional and international legally binding instruments, as described in paragraph 8 of the report of the Secretary-General,1 dangerous goods that are moved internationally have to be contained in packagings, containers and tanks bearing a “UN” mark certifying that they correspond to a design type that has been successfully tested under the control of the competent authority of the State authorizing the allocation of the mark,

一种太阳能模块与其制作方法,太阳能模块包含背板(110)、反射结构(130)、至少一个太阳能电池单元(120)、下封装材(140)、上封装材(142)与透光基板(150)。
The solar module comprises a back panel (110), a reflection structure (130), at least one solar cell unit (120), a lower packaging material, an upper packaging material (140), and a light permeable substrate (150).

散热片增加了芯片的散热面积,可以大幅度的提升POP堆叠封装的散热能力,突破POP堆叠封装的高密,小型化的瓶颈,提升POP堆叠封装的封装密度。
The chips (108, 105) on the carrier boards (109, 106) other than the top layer of the carrier board (103) are attached to the heat dissipation plates (107, 104) adjacent to the chips (108, 105).

本发明的封装设备可同一时间对多张小卡进行芯片封装,个人化数据处理,易于实现自动化多件加工,生产效率高。
The card base is provided with a chip slot.

将OLED器件简单薄膜封装后再贴覆一层多功能封装膜即可实现抗反射、阻水氧的作用,工艺操作简单,并且可有效降低OLED器件的厚度和重量,进而提升其显示品质。
Process operations are simple, and the thickness and the weight of the OLED component can be effectively reduced, thereby improving the display quality thereof.

委员会还获悉:训研所大楼已有 # %的石棉被拆除,其余的 # %(主要在地面层)仍然处于封装状态。
The Committee was also informed that, with regard to the UNITAR building # per cent of the asbestos had been removed and the remaining # per cent remained encapsulated, mainly on the ground floor

一种有源矩阵式有机电致发光二极管面板的封装结构,包括:基板(20)、位于基板(20)上的画素区域(26)、位于基板(20)上画素区域(26)外的数圈无机封装材(24)、位于基板(20)上画素区域(26)外的数圈有机接着材(22)、及覆盖在无机封装材(24)及有机接着材(22)上的背盖,数圈无机封装材(24)中至少有一圈密闭围绕画素区域(26)、数圈有机接着材(22)中至少有一圈密闭围绕画素区域(26),无机封装材(24)与有机接着材(22)分离设置。
The pixel area (26) is surrounded by at least one circle of the inorganic packaging materials (24) and at least one circle of the organic adhesive materials (22) hermetically, and the inorganic packaging materials (24) and the organic adhesive materials (22) are arranged separately.