coefficient of thermal conductivity oor Sjinees
coefficient of thermal conductivity
Vertalings in die woordeboek Engels - Sjinees
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voorbeelde
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Coefficient of thermal conductivity, they are not the same, hot water through cold water, cold water pipe can pass hot water.
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The main influencing factors of tungsten copper FGM thermal shock resistance include CTE (Coefficient of Thermal Expansion), thermal conductivity, elastic modulus, material inherent strength, fracture toughness.
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6) low coefficient of expansion, thermal conductivity, electrical conductivity and iron and its alloys are similar
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Due to continuous extrusion of tightly closed pore structure, its density, water absorption, coefficient of thermal conductivity and vapor permeability are lower than other types of plate, is widely regarded as one of the best heat preservation material current market.
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AlN particle has high thermal conductivity (200W/m•K), is close to BeO and SiC and 5 times higher than Al2O3, low CTE (Coefficient of Thermal Conductivity), excellent mechanical properties and electrical properties, which can control the properties of W-Cu/AlN composite material by different content.
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Such tungsten rod has low thermal expansion coefficient of material, and good thermal conductivity.
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For example, in the light emitting component and aluminum substrate bonding, heat conduction glue can play a key role, some manufacturers think thermal conductive film or coefficient of thermal conductivity of thermal conductive rubber gasket is better, the film thickness is as thick as possible, don"t want to thermal resistance.
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This kind of steel is usually does not contain nickel, sometimes also contain a small amount of Mo, Ti, Nb waits until the element, this kind of steel with high coefficient of thermal conductivity, small coefficient of expansion, good oxidation resistance, anti stress characteristics and other excellent stress corrosion, used for the manufacture of air resistance, water vapor, water and oxidizing acidcorrosion of parts.
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Electronic Packaging Materials Both the low-expansion properties of tungsten, but also has high thermal conductivity properties of copper, its thermal expansion coefficient and thermal conductivity of conductive material can be adjusted to change the composition and thereby to the material provided to facilitate the use.
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Electronic Packaging Materials Both the low-expansion properties of tungsten , but also has high thermal conductivity properties of copper, its thermal expansion coefficient and thermal conductivity of conductive material can be adjusted to change the composition and thereby to the material provided to facilitate the use.
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Tungsten Copper Functionally Graded Tungsten Copper Functionally Graded Tungsten copper functionally graded is metal-matrix-composite mount is made of a minimum of two metal compositions and has at least two discrete portions in the x-y plane: a high-thermal-conductivity, high-coefficient-of-thermal-expansion functional insert and a surrounding body with lower thermal conductivity and a lower coefficient of thermal expansion.
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Tungsten alloy not only has high density , it has a series of excellent properties, such as high strength, high hardness, good ductility, mechanical processing performance, small coefficient of thermal expansion , big coefficient of heat conductivity, resistance to oxidation and corrosion resistance, good weldability.
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Low expansion characteristics of both tungsten electronic packaging materials, but also has high thermal conductivity properties of copper, the thermal expansion coefficient and electrical and thermal conductivity can be varied by adjusting the composition of the material, giving the use of materials facilitated.
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Other features also include carbide is superior to most of its thermal conductivity and a low coefficient of friction of steel.
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Electronic Packaging Materials: low expansion characteristics of both tungsten, and having a high thermal conductivity properties of the copper, its thermal expansion coefficient and thermal conductivity can adjust the composition of the materials be changed, thereby to provide a convenient use of the material.
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Advanced electronic packaging materials: both tungsten low expansion characteristics, but also has high thermal conductivity properties of copper, the thermal expansion coefficient - and electrical and thermal conductivity can be varied by adjusting the composition of the material, giving the use of materials facilitated.
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   Tungsten copper alloy, with high thermal conductivity and low coefficient of thermal expansion, which is widely used in  high-power devices as heat sink.
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Tungsten copper laser heat sink combines the advantages of tungsten and copper, both having low expansion characteristics of tungsten, but also has high thermal conductivity properties of copper, its thermal expansion coefficient and thermal conductivity can be varied by adjusting the tungsten copper component, while and coefficient of thermal expansion of silicon, gallium arsenide, and the ceramic material matches. Technical Specifications
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The 4H silicon carbide crystal has characteristics of high laser damage threshold, wider light transmission range (0.38-5.9μm up to 6.6-7.08μm), greater second-order nonlinear optical coefficient (d15=6.7pm/V), greater birefringence, high thermal conductivity (490 Wm-1Κ-1) and high chemical stability.
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Toughness, thermal expansion coefficient, thermal conductivity, the content of TiC, TaC and Co
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Since the copper tungsten material has a high heat resistance and good thermal conductivity, and also coefficient of thermal expansion match with silicon, GaAs, and ceramics, and therefore widely used in the semiconductor material.
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Silica in the silica glass is in an amorphous state, so has a very low coefficient of thermal expansion and thermal conductivity and a sharp temperature drop does not crack.
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Particularly valuable is that its thermal expansion coefficient and thermal conductivity of the material composition can be adjusted to be designed and thus to the application of the material brought great convenience.
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Tungsten Copper Alloy for Microelectronic Materials Copper tungsten electronic package and the heat sink material, both having a tungsten low expansion characteristics, also has a copper of high thermal conductivity characteristics, its thermal expansion coefficient and thermal conductivity of the conductive properties may be by adjusting the tungsten and copper components and be changed, and thus to the tungsten and copper provide a more wide range of applications.
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Advantages: a substrate having a different coefficient of thermal expansion match, and high thermal conductivity; excellent high temperature stability and uniformity; excellent processing performance.
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72 sinne gevind in 16 ms. Hulle kom uit baie bronne en word nie nagegaan nie.