flip chip packaging oor Spaans
flip chip packaging
en
A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins.
Vertalings in die woordeboek Engels - Spaans
empaquetado flip-chip
en
A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins.
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voorbeelde
Advanced filtering
Voorbeelde moet herlaai word.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’
Yo tenía que ahorrar para la gasolineríaEurLex-2 EurLex-2
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
A ver si aciertoEurLex-2 EurLex-2
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Y él tiene un plan para nosotroseurlex-diff-2018-06-20 eurlex-diff-2018-06-20
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
Globalmente, el rendimiento de las inversiones se mantuvo negativo y se deterioró en #,# puntos porcentuales durante el período consideradoEurLex-2 EurLex-2
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Empieza revisando los alrededores de esta tiendanot-set not-set
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
Ahora recuerdasoj4 oj4
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
No sea tímidaEurLex-2 EurLex-2
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
No comprende que soy un funcionario autorizado porEurLex-2 EurLex-2
69 sinne gevind in 16 ms. Hulle kom uit baie bronne en word nie nagegaan nie.