The following types of DRAMs are covered by these CN/TARIC codes: wafers, chips (dies), memories (chips mounted, i.e. with their terminals or leads, whether or not encased in ceramic, metal, plastics or other materials, hereafter referred to as ‘mounted DRAMs’ and known commercially as DRAM components) and DRAM modules, memory boards and some other kind of aggregate form (hereafter referred to as multi-combinational forms of DRAMs).
Följande typer av dram-minnen omfattas av dessa nummer: plattor, chips, minnen (monterade chips, dvs. med anslutningar samt föreliggande med eller utan hölje i keramiskt material, metall, plast eller andra material, nedan kallade ”monterade dram-minnen” och kommersiellt kända under namnet dram-komponenter) och dram-moduler, minneskort eller andra sammansatta former (nedan kallade ”dram-minnen i sammansättningar”).EurLex-2 EurLex-2