thick-film technology oor Grieks
thick-film technology
Vertalings in die woordeboek Engels - Grieks
τεχνολογία φιλμ παχέος στρώματος
Geskatte vertalings
Vertoon algoritmies gegenereerde vertalings
voorbeelde
Advanced filtering
Voorbeelde moet herlaai word.
31 THE HYBRID INTEGRATED CIRCUITS REFERRED TO IN SUBPARAGRAPH ( C ) OF THE NOTE IN QUESTION ARE CHARACTERIZED BY THE FACT THAT SOME ELEMENTS OF SUCH MICRO-CIRCUITS ARE OBTAINED BY THIN- OR THICK-FILM TECHNOLOGY WHILST OTHERS ARE OBTAINED BY SEMI-CONDUCTOR TECHNOLOGY .
Περάσαμε ταEurLex-2 EurLex-2
32 IT FOLLOWS THAT NOTE 5 ( B ) ( C ) COVERS MODULES CONTAINING ALL KINDS OF ELEMENTS OBTAINED BY SEMI-CONDUCTOR TECHNOLOGY , INCLUDING THOSE WHICH CONSIST , APART FROM THEIR COMPONENTS MANUFACTURED BY THIN- OR THICK-FILM TECHNOLOGY , EXCLUSIVELY OF DISCRETE COMPONENTS IN THE SENSE DESCRIBED ABOVE .
Υπάρχει και κάτι άλλο που πρέπει να δειςEurLex-2 EurLex-2
(b) hybrid integrated circuits in which passive elements (resistors, capacitors, interconnections, etc.), obtained by thin-or thick-film technology, and active elements (diodes, transistors, monolithic integrated circuits, etc.), obtained by semiconductor technology, are combined to all intents and purposes indivisibly, on a single insulating substrate (glass, ceramic, etc.).
Πόρτα ένα.ΑνοίγειEurLex-2 EurLex-2
(b) hybrid integrated circuits in which passive elements (resistors, capacitors, interconnections, etc.), obtained by thin- or thick-film technology, and active elements (diodes, transistors, monolithic integrated circuits, etc.), obtained by semiconductor technology, are combined to all intents and purposes indivisibly, on a single insulating substrate (glass, ceramic, etc.).
Εισφορές κοινωνικής ασφάλισης οι οποίες οφείλονται στην ΕπιτροπήEurLex-2 EurLex-2
NOTE 5 ( B ) ( C ) MUST BE INTERPRETED AS MEANING THAT HYBRID INTEGRATED CIRCUITS INCLUDE MODULES COMPRISING ALL KINDS OF ELEMENTS OBTAINED BY SEMI-CONDUCTOR TECHNOLOGY , AS WELL AS MODULES CONSISTING , APART FROM THEIR COMPONENTS MANUFACTURED BY THIN- OR THICK-FILM TECHNOLOGY , EXCLUSIVELY OF DISCRETE COMPONENTS IN THE SENSE DESCRIBED ABOVE .
Τότε θα πείσεις την αστυνομία να σου τον παραδώσειEurLex-2 EurLex-2
( C)HYBRID INTEGRATED CIRCUITS IN WHICH PASSIVE AND ACTIVE ELEMENTS , SOME OBTAINED BY THIN- OR THICK FILM TECHNOLOGY ( RESISTORS , CAPACITORS , INTER-CONNECTIONS , ETC .), OTHERS BY SEMI-CONDUCTOR TECHNOLOGY ( DIODES , TRANSISTORS , MONOLITHIC INTEGRATED CIRCUITS , ETC .), ARE COMBINED , TO ALL INTENTS AND PURPOSES INDIVISIBLY , ON A SINGLE INSULATING SUBSTRATE ( GLASS , CERAMIC , ETC .).
Παραλίγο να τα κάνω πάνω μουEurLex-2 EurLex-2
35 THE ANSWER TO THE QUESTION RAISED SHOULD THEREFORE BE THAT NOTE 5 ( B ) ( C ) MUST BE INTERPRETED AS MEANING THAT HYBRID INTEGRATED CIRCUITS INCLUDE MODULES COMPRISING ALL KINDS OF ELEMENTS OBTAINED BY SEMI-CONDUCTOR TECHNOLOGY , AS WELL AS MODULES CONSISTING , APART FROM THEIR COMPONENTS MANUFACTURED BY THIN- OR THICK-FILM TECHNOLOGY , EXCLUSIVELY OF DISCRETE COMPONENTS IN THE SENSE DESCRIBED ABOVE .
Καλά, ας αρχίσουμε απ' τα εύκολαEurLex-2 EurLex-2
IT IS CLEAR FROM THE ORDER MAKING THE REFERENCE THAT THE PURPOSE OF THE QUESTION IS PRIMARILY TO DETERMINE WHETHER THE ELEMENTS MANUFACTURED BY SEMI-CONDUCTOR TECHNOLOGY , UTILIZED TO FORM A HYBRID INTEGRATED CIRCUIT SIDE BY SIDE WITH COMPONENTS MANUFACTURED BY THIN- OR THICK-FILM TECHNOLOGY , MUST IN THE MAIN BE NON-DISCRETE COMPONENTS OR WHETHER THEY MAY ALSO BE EXCLUSIVELY DISCRETE COMPONENTS , IN THE SENSE DESCRIBED ABOVE .
Με υποπτεύονται και θέλουν να είστε προστατευμένεςEurLex-2 EurLex-2
Active and passive electric and electronic components manufactured using thick-film and thin-film technology
Να προσέχειςtmClass tmClass
Electronic components, Namely substrates for thick-film and thin-film technology, non-metallised and metallised substrates, metallised ceramics
Δεν θεωρούμε ότι τα ζητήματα που αφορούν την νομοθεσία για το περιβάλλον θα πρέπει να υπόκεινται σε διαδικασία συναπόφασης.tmClass tmClass
Thermal printer heads of thick or thin film technology consisting of a printed circuit with at least one tantalum capacitor and an electrolytic capacitor contained in a metal support with connector, printer element and heat sink, supplied with the appropriate support and transport roll
Επειδή ήξερα πως αν στο έλεγα νωρίτερα, θα αναστατωνόσουν πολύ, και μετά θα κατηγορούσες τον Χένρι, και θα προσπαθούσες να με κάνεις να μείνωEurLex-2 EurLex-2
Thermal printer heads of thick or thin film technology consisting of a printed circuit with at least one tantalum capacitor and an electrolytic capacitor contained in a metal support with connector, printer element and heat sink, supplied with the appropriate support and transport roll
Εδώ είμαστε λοιπόνEurLex-2 EurLex-2
Thin-or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading No .
Πέρεγκριν Τουκ, υπάρχει κάτι που πρέπει να γίνειEurLex-2 EurLex-2
Thin-or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading 8542.
Αυτο ηταν. Δεν αντεχω αλλοEurLex-2 EurLex-2
Thin- or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading No 8542.
Δεύτερη πόρταEurLex-2 EurLex-2
Thin or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified within heading N° 8542.
Τότε θα πείσεις την αστυνομία να σου τον παραδώσειEurLex-2 EurLex-2
Thin-or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading No 8542.
Ήσασταν πολύ καλοί γονείς για μαςEurLex-2 EurLex-2
Thin or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified within heading No 8542.
Καλά Χριστούγεννα!EurLex-2 EurLex-2
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